DCP-Sr. Power Electronics Engineer（Global）-Shenzhen

电力电子高级工程师（深圳）

工作地点：深圳

岗位职责

1. 电力电子产品研发
2. 技术验证与测试
3. 标准与合规
4. 团队支持与指导

任职要求

• 本科及以上学历，电力电子、自动化或相关专业。
• 5年以上电力电子产品研发经验，有通信电源、AI服务器电源、HVDC、光伏/储能逆变器、充电桩等相关经验优先。
• 精通常用电力电子拓扑（如Buck/Boost、LLC、全桥、三电平等），熟悉磁性元件设计与热仿真。
• 熟悉电力电子器件（IGBT、SiC、GaN等）的应用与驱动设计。
• 熟悉DSP应用，能软硬件联调，熟悉Matlab，Mathcad等软件使用优先
• 具备良好的英语沟通能力，能与海外研发团队顺畅交流。
• 具有较强的创新能力、分析与解决问题能力。
• Senior Power Electronics Engineer (Shenzhen)
• Location: Shenzhen

Responsibilities

1. Power Electronics Product Development

• Responsible for solution design, component selection, and circuit development of power electronics products.
• Responsible for topology design, magnetic component design, and thermal design to ensure system performance and reliability.

1. Technical Verification & Testing

• Organize and perform electrical performance, safety, and EMC testing; drive prototype verification and functional debugging.
• Analyze and resolve electrical, thermal, and EMI/EMC issues during the development process.

1. Standards & Compliance

• Familiar with and able to apply international/domestic power electronics standards (e.g., IEC, UL, GB), ensuring designs meet safety and quality requirements.
• Keep track of cutting-edge technologies and component trends in the power electronics industry and apply them in product development.

1. Team Support & Guidance

• Provide technical training and guidance for junior and mid-level engineers.
• Participate in technical reviews and patent writing to enhance the team’s overall R&D capability.

Requirements

• Bachelor’s degree or above in Power Electronics, Automation, or related majors.
• Over 5 years of experience in power electronics product R&D; experience in telecom power supply, AI server power, HVDC, PV/energy storage inverters, or EV chargers is preferred.
• Proficient in common power electronics topologies (e.g., Buck/Boost, LLC, Full Bridge, Three-Level), with expertise in magnetic component design and thermal simulation.
• Familiar with power semiconductor devices (IGBT, SiC, GaN) and their driver design.
• Experience with DSP applications, hardware-software co-debugging; familiarity with Matlab, Mathcad is a plus.
• Good English communication skills, able to work smoothly with overseas R&D teams.
• Strong innovation, analytical, and problem-solving abilities.